Participation in Wire Processing Technology Expo (by our agency in USA)

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Participation in Wire Processing Technology Expo (by our agency in USA)
2018-04-26 10:23:20
We would like to announce that Crimping & Stamping Technologies Inc,.
(our agency in USA) is going to exhibit our products
at 
National Electrical Wire Processing Technology Expo 2018.
We are sincerely looking forward to you visiting the exhibition and the booth.
 
Dates
May 9th(Wed)-May 10th(Thu), 2018
 
Place
Wisconsin Center
 
Address: Halls A, B & C 400 W Wisconsin Ave.Milwaukee, WI 53203, USA
Booth: 1405
 
Exhibited products
-New Product: Crimp Force Monitor CFM-Lite (Detail for CFM-Lite)
-Automatic Pull Tester APT (Detail for APT)
-Crimp Vision Monitor CVM-3 (Detail for CVM-3)

For details, please refer to “Wire Processing Technology Expo” (English)

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